8/11/2023 0 Comments Soldering iron for ona holes![]() ![]() Careful cleaning of surfaces prior to soldering may be needed. The activity of the flux was not sufficient, and external flux may be necessary. If the solder does not melt onto the area, the most likely cause is insufficient heat has been transferred to it, or the surface needs to be cleaned of grease or dirt.The molten solder should "cling" to the pad and lead together via surface tension. The component lead and the pad should be heated enough for the solder to melt into the connection point. It is burned off slowly (this is the smoke rising from the joint) and loses its effectiveness as it does so. Flux from the solder wire is only active very briefly maximum after melting onto the joint. The residue is corrosive and may also damage the board or components if not cleaned correctly after use.įeed the solder wire onto the interface between the pad and lead. Water-soluble flux usually has a higher activity that leaves a residue which must be cleaned with water.This flux is designed to be left on the solder joint and surrounding areas. No-clean flux leaves a clear residue after soldering, which is non-corrosive and non-conductive. ![]() Cleaning can be accomplished with a purpose-formulated rosin removal product, or with isopropyl alcohol.
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